MK

High performance in marking processes prior to plate processing.

  • Combines all existing marking technologies: laser, plasma, ink, scribing, etc.
  • Allows the separation of the marking process from the cutting process.
  • It considerably increases production in work lines and 4.0 installations
  • It can process multi-line texts, bar codes, datamatrix, images and most vectorial formats (e.g. SVG, DXF, BMP, JPG)

MK

High performance in marking processes prior to plate processing.

  • Combines all existing marking technologies: laser, plasma, ink, scribing, etc.
  • Allows the separation of the marking process from the cutting process.
  • It considerably increases production in work lines and 4.0 installations
  • It can process multi-line texts, bar codes, datamatrix, images and most vectorial formats (e.g. SVG, DXF, BMP, JPG)

technologies

CISCAD

Large dimensions laser cutting

Tube and profile laser cutting

Maximum productivity in a reduced space

Machining

Plasma, oxyfuel and machining cutting stations

High-speed plasma

Tube and profile cutting

Compact models

Machining

High machining capabilites

Machining combined with plasma and oxyfuel cutting

Intensive use

Automated plate storage 4.0

Manual and automatic

Waste Disposal

Fume extraction and noise reduction

Cutting tables

Multifunción combinada plasma, oxicorte y mecanizado

Plasma alta velocidad

Corte de tubos y perfiles

Modelos compactos

Marcado

Grandes formatos y espesores

CORTES DE TUBOS Y PERFILES

maxima productividad en menor espacio

marcado